Micron Technology

HQ
Boise
Total Offices: 5
45,000 Total Employees
Year Founded: 1978

Micron Technology Offices

Micron Technology is headquartered in Boise and has 5 office locations.

Hybrid Workplace

Employees engage in a combination of remote and on-site work.

Micron recognizes the importance of maintaining a healthy work-life balance to foster a culture of collaboration, innovation and meet the needs of the business. In alignment with these values, we offer four flexible work arrangement options

Typical time on-site: Flexible

U.S. Office Locations

HQ
Boise

Boise, ID

Boise is a city where work, nature, and everyday life are closely connected. It’s a place where people work hard but also make time to enjoy life outside the office — whether that means an evening walk along the river, a weekend hike in the foothills, or skiing after work in the winter.

Folsom

2235 Iron Point Rd, Folsom, CA, United States, 95630

Longmont

1900 Pike Rd, Longmont, CO, United States, 80501

Manassas

9600 Godwin Dr, Manassas, VA, United States, 20110

Milpitas

540 Alder Dr, Milpitas, CA, United States, 95035

4 Days AgoSaved
In-Office or Remote
2 Locations
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Develop and integrate silicon photonics, semiconductor processes, advanced packaging, optical interconnects, and heterogeneous integration technologies from concept through manufacturing readiness. Lead process characterization, DOE execution, yield improvement, defect reduction, root-cause analysis, design-rule development, tapeouts, technology transfers, technical programs, roadmaps, and AI-enabled engineering initiatives across multidisciplinary teams.
7 Days AgoSaved
In-Office or Remote
2 Locations
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Lead silicon photonics and heterogeneous integration development from concept through manufacturing readiness. Responsibilities include process-flow integration, photonic device and advanced packaging development, DOE execution, process characterization, yield improvement, defect reduction, root-cause analysis, design-rule development, tapeouts, technology transfers, technical roadmaps, and AI-enabled engineering initiatives. The role collaborates with design, device, packaging, manufacturing, and supplier teams to deliver optical connectivity technologies for high-performance computing and AI infrastructure.