The role involves leading the physical design of ASICs, overseeing all phases from RTL to GDSII, and enhancing design methodologies.
Join the leading chiplet startup! As an Eliyan Sr Staff / Principal Physical Design Engineer, you will be working at a fast-paced early-stage startup creating technologies that fuel tomorrow’s chiplet based systems with best-in-class power, area, manufacturability, and design flexibility. You will drive the development of cutting-edge ASICs from RTL to GDSII. You will work with a cross-functional team of industry experts that operate from first principles, innovate, and push the envelope to create high-volume and high-performance manufacturable products. In this role, you will oversee and optimize the entire design flow, including synthesis, place-and-route (PNR), static timing analysis (STA), electromigration/IR drop analysis (EM/IR), and physical verification (PV – DRC, LVS, Antenna). You will also focus on developing and improving design flows and methodologies to ensure high-quality, on-time delivery. We offer a fun work environment with excellent benefits.
Responsibilities:
- Define and execute IP block and partition physical design strategy across projects, aligning schedules, resources, and milestones to company tapeout goals.
- Lead mixed signal placement and routing, enforcing analog keepouts, shielding, and DRC aware methodologies while integrating digital logic cleanly.
- Own system and block integration for floorplanning, power, placement, CTS, and constraints, ensuring consistent interfaces across hierarchy and reuse
- Drive end to end IP physical implementation from RTL handoff through GDSII, managing iterations, ECOs, and closure plans across corners
- Develop and maintain block specific flow customizations for synthesis, PNR, EM IR, STA, and physical verification to improve QoR and predictability
- Deliver robust constraints methodology, pushing timing intent from system to block and back, maintaining mode and corner correctness for signoff
- Run and close subsystem signoff including STA, EM IR, SI, DRC, LVS, antenna, and metal fill, meeting reliability and manufacturability requirements
- Optimize clock architecture and CTS for skew, latency, and power, including skew group definitions and balancing across library corners
- Collaborate with front end, DFT, packaging, and manufacturing to resolve integration risks, test mode impacts, and physical interface requirements
- Provide clear status, risk, and mitigation reporting to leadership, using metrics driven dashboards for PPA, convergence, and schedule predictability
Minimum Qualifications:
- Expertise in physical design, timing closure, and signoff for small to large ASIC IP blocks, including mixed signal integration and subsystem closure ownership
- Strong hands-on experience with floorplanning, power planning, placement, CTS, routing, EM IR, STA, and PV signoff across MMMC scenarios
- Proven ability to improve flows through automation and scripting, with disciplined debug skills and data driven QoR and runtime optimization mindset
- Excellent cross functional leadership and communication skills to drive alignment, technical reviews, and closure decisions under aggressive timelines
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