Lead High NA EUV initiatives at NYCreates, manage engineers and technicians, coordinate tooling and logistics, define patterning pathfinding projects, benchmark performance, develop roadmaps, and collaborate across global Micron TD sites to enable next-generation photolithography and AI-enabled solutions.

Lead silicon photonics and heterogeneous integration development from concept through manufacturing readiness. Responsibilities include process-flow integration, photonic device and advanced packaging development, DOE execution, process characterization, yield improvement, defect reduction, root-cause analysis, design-rule development, tapeouts, technology transfers, technical roadmaps, and AI-enabled engineering initiatives. The role collaborates with design, device, packaging, manufacturing, and supplier teams to deliver optical connectivity technologies for high-performance computing and AI infrastructure.

The Dry Etch Process Develop Engineer will develop and optimize plasma etch processes for memory devices, collaborating with cross-functional teams to enhance manufacturing techniques and improve process metrics.